Electrochemical-deposition system, apparatus, and method using optically-controlled deposition electrodes

ABSTRACT

An electrochemical-deposition apparatus includes an electrode array, a photoconductor, an electrically conductive layer, an electromagnetic-radiation emitter, an electric-power source, and a controller. The controller is configured to direct electric power to be supplied from the electric-power source to the electrically conductive layer and direct the electromagnetic-radiation emitter to generate electromagnetic radiation. When the electric power is supplied to the electrically conductive layer and when the electromagnetic radiation is generated, the photoconductor is illuminated at a first radiation level and a first level of electric current is enabled through the photoconductor and the at least one deposition electrode. When the electric power is supplied to the electrically conductive layer and when the electromagnetic radiation is generated, the photoconductor is illuminated at a second radiation level and a second level of electric current is enabled through the photoconductor and the at least one deposition electrode.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of U.S. Provisional PatentApplication No. 63/228,365, filed Aug. 2, 2021, which is incorporated byreference in its entirety.

FIELD

This disclosure relates generally to manufacturing parts, and moreparticularly to systems and methods for manufacturing parts usingelectrochemical additive manufacturing techniques.

BACKGROUND

Electrochemical additive manufacturing utilizes electrochemicalreactions to manufacture parts in an additive manufacturing manner. Inan electrochemical additive manufacturing process, a metal part isconstructed by plating charged metal ions onto a surface in contact withan electrolytic solution. This technique relies on placing an electrodephysically close to a substrate in the presence of an electrolyticsolution, and energizing the electrode, which causes an electric chargeto flow through the electrode, the electrolytic solution, and thesubstrate. The flow of electric charge induces an electrochemicalreduction reaction to occur, at the substrate near the electrode, and adeposition of material, from the electrolytic solution, on thesubstrate.

Although electrochemical additive manufacturing techniques providedistinct advantages over other types of additive manufacturingprocesses, such as selective laser melting and electron beam melting,controlling the flow of electric charge through the electrode, theelectrolytic solution, and the substrate in a reliable, an efficient andan accurate manner can be difficult.

SUMMARY

The subject matter of the present application has been developed inresponse to the present state of the art, and in particular, in responseto the shortcomings of conventional systems and methods for additivemanufacturing of parts, that have not yet been fully solved by currentlyavailable techniques. Accordingly, the subject matter of the presentapplication has been developed to provide systems and methods for theelectrochemical additive manufacturing of parts that overcome at leastsome of the above-discussed shortcomings of prior art techniques.

The following is a non-exhaustive list of examples, which may or may notbe claimed, of the subject matter, disclosed herein.

Disclosed herein is an electrochemical-deposition apparatus thatcomprises an electrode array, which comprises deposition electrodes. Theelectrochemical-deposition apparatus also comprises a photoconductorthat is electrically coupled with at least one of the depositionelectrodes. The electrochemical-deposition apparatus additionallycomprises an electrically conductive layer that is electrically coupledwith the photoconductor and positioned so that the photoconductor iselectrically interposed between the at least one deposition electrodeand the electrically conductive layer. The electrochemical-depositionapparatus further comprises an electromagnetic-radiation emitter that isconfigured to generate electromagnetic radiation and is positioned sothat when generated, at least a portion of the electromagnetic radiationilluminates the photoconductor, an electric-power source, configured tosupply electric power to the electrically conductive layer, and acontroller. The controller is configured to direct the electric power tobe supplied from the electric-power source to the electricallyconductive layer and direct the electromagnetic-radiation emitter togenerate the electromagnetic radiation when the electric power issupplied to the electrically conductive layer. When the electric poweris supplied to the electrically conductive layer and when theelectromagnetic radiation is generated, so that the photoconductor isilluminated at a first radiation level, a first level of electriccurrent is enabled through the photoconductor and the at least onedeposition electrode. When the electric power is supplied to theelectrically conductive layer and when the electromagnetic radiation isgenerated, so that the photoconductor is illuminated at a secondradiation level, a second level of electric current is enabled throughthe photoconductor and the at least one deposition electrode. The secondlevel of the electric current is different than the first level of theelectric current. The preceding subject matter of this paragraphcharacterizes example 1 of the present disclosure.

The electrically conductive layer is interposed between theelectromagnetic-radiation emitter and the photoconductor. Whengenerated, at least a portion of the electromagnetic radiation passesthrough the electrically conductive layer and illuminates thephotoconductor. The preceding subject matter of this paragraphcharacterizes example 2 of the present disclosure, wherein example 2also includes the subject matter according to example 1, above.

The electrically conductive layer comprises an electrically conductivematerial that is at least partially transparent to the at least theportion of the electromagnetic radiation. The preceding subject matterof this paragraph characterizes example 3 of the present disclosure,wherein example 3 also includes the subject matter according to example2, above.

The electromagnetic radiation is one of visible light or non-visiblelight. The electrically conductive material is transparent to the one ofthe visible light or the non-visible light. The preceding subject matterof this paragraph characterizes example 4 of the present disclosure,wherein example 4 also includes the subject matter according to example3, above.

The electrically conductive material comprises an aperture, throughwhich the at least the portion of the electromagnetic radiation ispassable from the electromagnetic-radiation emitter to thephotoconductor. The preceding subject matter of this paragraphcharacterizes example 5 of the present disclosure, wherein example 5also includes the subject matter according to any of examples 3 or 4,above.

The electrically conductive layer further comprises an electricallynon-conductive substrate. The electrically non-conductive substrate isat least partially transparent to the at least the portion of theelectromagnetic radiation. The electrically non-conductive substrate isinterposed between the electrically conductive material and theelectromagnetic-radiation emitter so that, when generated, the at leastthe portion of the electromagnetic radiation passes through theelectrically non-conductive substrate. The preceding subject matter ofthis paragraph characterizes example 6 of the present disclosure,wherein example 6 also includes the subject matter according to any ofexamples 3-5, above.

The electrochemical-deposition apparatus further comprises aphotoconductor array that comprises a plurality of photoconductors. Thephotoconductor is one of the plurality of photoconductors and each oneof the plurality of photoconductors is electrically coupled with acorresponding one or more of the plurality of deposition electrodes. Theelectromagnetic-radiation emitter is configured to generate theelectromagnetic radiation so that, when generated, at least the portionof the electromagnetic radiation illuminates any one or more of theplurality of photoconductors. The preceding subject matter of thisparagraph characterizes example 7 of the present disclosure, whereinexample 7 also includes the subject matter according to any of examples1-6, above.

When the electromagnetic radiation is generated, the electromagneticradiation illuminates at least two of the plurality of photoconductors,a first one of the at least two of the plurality of photoconductorsreceives a first quantity of the electromagnetic radiation, a second oneof the at least two of the plurality of photoconductors receives asecond quantity of the electromagnetic radiation, and the first quantityis different than the second quantity. The preceding subject matter ofthis paragraph characterizes example 8 of the present disclosure,wherein example 8 also includes the subject matter according to example7, above.

The electromagnetic-radiation emitter is movable, relative to thephotoconductor array. The preceding subject matter of this paragraphcharacterizes example 9 of the present disclosure, wherein example 9also includes the subject matter according to any of examples 7-8,above.

The electromagnetic-radiation emitter comprises a plurality ofelectromagnetic-radiation-generating elements, spaced apart from eachother and each configured to one of selectively generate theelectromagnetic radiation, or selectively permit the electromagneticradiation to pass therethrough. The preceding subject matter of thisparagraph characterizes example 10 of the present disclosure, whereinexample 10 also includes the subject matter according to any of examples7-9, above.

The electromagnetic-radiation emitter comprises a laser. Theelectromagnetic radiation is a laser beam. The preceding subject matterof this paragraph characterizes example 11 of the present disclosure,wherein example 11 also includes the subject matter according to any ofexamples 1-10, above.

The electromagnetic-radiation emitter comprises a light-emitting diode.The preceding subject matter of this paragraph characterizes example 12of the present disclosure, wherein example 12 also includes the subjectmatter according to any of examples 1-11, above.

The electromagnetic-radiation emitter comprises a liquid crystal displayand a backlight source. The liquid crystal display is interposed betweenthe backlight source and the photoconductor. The preceding subjectmatter of this paragraph characterizes example 13 of the presentdisclosure, wherein example 13 also includes the subject matteraccording to any of examples 1-12, above.

Further disclosed herein is an electrochemical-deposition system thatcomprises an electrolytic solution and a target electrode, which ispositionable so that a surface of the target electrode is in directphysical contact with the electrolytic solution. Theelectrochemical-deposition system further comprises anelectrochemical-deposition apparatus, which comprises a depositionelectrode that is positionable so that a surface of the depositionelectrode is in direct physical contact with the electrolytic solution.The electrochemical-deposition apparatus further comprises aphotoconductor that is electrically coupled with the depositionelectrode. The electrochemical-deposition apparatus additionallycomprises an electrically conductive layer that is electrically coupledwith the photoconductor and positioned so that the photoconductor iselectrically interposed between the deposition electrode and theelectrically conductive layer. The electrochemical-deposition apparatusalso comprises an electromagnetic-radiation emitter that is configuredto generate electromagnetic radiation and positioned so that whengenerated, at least a portion of the electromagnetic radiationilluminates the photoconductor, which, when the surface of the targetelectrode and the surface of the deposition electrode are in directphysical contact with the electrolytic solution, establishes an electriccurrent through the photoconductor, the deposition electrode, theelectrolytic solution, and the target electrode to electroplate aquantity of electrically charged material in the electrolytic solutiononto the surface of the target electrode. The preceding subject matterof this paragraph characterizes example 14 of the present disclosure.

The electrochemical-deposition apparatus further comprises a pluralityof deposition electrodes and a plurality of photoconductors, eachelectrically coupled with a corresponding one of the plurality ofdeposition electrodes. The electromagnetic-radiation emitter isconfigured to selectively generate separate quantities of theelectromagnetic-radiation so that, when generated at least a portion ofeach one of the separate quantities of the electromagnetic radiationilluminates a corresponding one or corresponding ones of the pluralityof photoconductors. The preceding subject matter of this paragraphcharacterizes example 15 of the present disclosure, wherein example 15also includes the subject matter according to example 14, above.

When the surface of the target electrode and the surface of thedeposition electrode are in direct physical contact with theelectrolytic solution, the electrically conductive layer is interposedbetween the electromagnetic-radiation emitter and the photoconductor,and when generated, at least a portion of the electromagnetic radiationpasses through the electrically conductive layer and illuminates thephotoconductor. The preceding subject matter of this paragraphcharacterizes example 16 of the present disclosure, wherein example 16also includes the subject matter according to any of examples 14-15,above.

Additionally disclosed herein is a method of electroplating a targetelectrode that comprises establishing direct physical contact between asurface of the target electrode and an electrolytic solution, comprisingelectrically charged material, establishing direct physical contactbetween a surface of a deposition electrode and the electrolyticsolution, and supplying electric power to an electrically conductivelayer. The method additionally comprises delivering at least a portionof electromagnetic radiation to a photoconductor that is electricallycoupled with the deposition electrode and with the electricallyconductive layer, so that an electric current is established through theelectrically conductive layer, the photoconductor, the depositionelectrode, the electrolytic solution, and the target electrode, and sothat a quantity of the electrically charged material in the electrolyticsolution is electroplated onto at least a portion of the surface of thetarget electrode in direct physical contact with the electrolyticsolution. The preceding subject matter of this paragraph characterizesexample 17 of the present disclosure.

Establishing direct physical contact between the surface of thedeposition electrode and the electrolytic solution comprisesestablishing direct physical contact between surfaces of a plurality ofdeposition electrodes and the electrolytic solution. Delivering the atleast the portion of the electromagnetic radiation to the photoconductorcomprises delivering the at least the portion of the electromagneticradiation to at least two of a plurality of photoconductors ordelivering a plurality of amounts of the electromagnetic-radiation to acorresponding one or multiple ones of the plurality of photoconductors.The preceding subject matter of this paragraph characterizes example 18of the present disclosure, wherein example 18 also includes the subjectmatter according to example 17, above.

Delivering the at least the portion of the electromagnetic radiation tothe photoconductor comprises adjusting at least one of an intensity or aquantity of the at least the portion of the electromagnetic radiationdelivered to the photoconductor so that an amplitude of the electriccurrent, established through the electrically conductive layer, thephotoconductor, the deposition electrode, the electrolytic solution, andthe target electrode, is adjusted, and the quantity of the electricallycharged material electroplated onto the at least the portion of thesurface of the target electrode is adjusted. The preceding subjectmatter of this paragraph characterizes example 19 of the presentdisclosure, wherein example 19 also includes the subject matteraccording to any of examples 17 or 18, above.

Delivering the at least the portion of the electromagnetic radiationfurther comprises passing the at least the portion of theelectromagnetic radiation through the electrically conductive layerbefore delivering the at least the portion of the electromagneticradiation to the photoconductor. The preceding subject matter of thisparagraph characterizes example 20 of the present disclosure, whereinexample 20 also includes the subject matter according to any of examples17-19, above.

The described features, structures, advantages, and/or characteristicsof the subject matter of the present disclosure may be combined in anysuitable manner in one or more examples and/or implementations. In thefollowing description, numerous specific details are provided to imparta thorough understanding of examples of the subject matter of thepresent disclosure. One skilled in the relevant art will recognize thatthe subject matter of the present disclosure may be practiced withoutone or more of the specific features, details, components, materials,and/or methods of a particular example or implementation. In otherinstances, additional features and advantages may be recognized incertain examples and/or implementations that may not be present in allexamples or implementations. Further, in some instances, well-knownstructures, materials, or operations are not shown or described indetail to avoid obscuring aspects of the subject matter of the presentdisclosure. The features and advantages of the subject matter of thepresent disclosure will become more fully apparent from the followingdescription and appended claims, or may be learned by the practice ofthe subject matter as set forth hereinafter.

BRIEF DESCRIPTION OF THE DRAWINGS

In order that the advantages of the subject matter may be more readilyunderstood, a more particular description of the subject matter brieflydescribed above will be rendered by reference to specific examples thatare illustrated in the appended drawings. Understanding that thesedrawings, which are not necessarily drawn to scale, depict only certainexamples of the subject matter and are not therefore to be considered tobe limiting of its scope, the subject matter will be described andexplained with additional specificity and detail through the use of thedrawings, in which:

FIG. 1 is a schematic, side elevation view of anelectrochemical-deposition system for manufacturing a part, according toone or more examples of the present disclosure;

FIG. 2 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 3 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 4 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 5 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 6 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 7 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 8A is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 8B is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 9 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 10 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 11A is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 11B is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure;

FIG. 12 is a schematic, side elevation, sectional view of anelectrochemical-deposition apparatus of the system of FIG. 1 , accordingto one or more examples of the present disclosure; and

FIG. 13 is a block diagram of a method of electroplating a targetelectrode, according to one or more examples of the present disclosure.

DETAILED DESCRIPTION

Reference throughout this specification to “one example,” “an example,”or similar language means that a particular feature, structure, orcharacteristic described in connection with the example is included inat least one example of the present disclosure. Appearances of thephrases “in one example,” “in an example,” and similar languagethroughout this specification may, but do not necessarily, all refer tothe same example. Similarly, the use of the term “implementation” meansan implementation having a particular feature, structure, orcharacteristic described in connection with one or more examples of thepresent disclosure, however, absent an express correlation to indicateotherwise, an implementation may be associated with one or moreexamples.

Disclosed herein are examples of an electrochemical-deposition system,apparatus, and method for constructing a metal part by depositingcharged metal ions onto a surface in contact with an electrolyticsolution. Electrochemical-deposition manufacturing includes placement ofa printhead, including a deposition electrode (e.g., anode), physicallyclose to a target electrode (e.g., cathode) in the presence of adeposition solution (e.g., an electrolytic solution), and energizing thedeposition electrode, which causes an electric current (i.e., electricpower) to flow through the deposition electrode, the depositionsolution, and the target electrode. The flow of the electric currentcreates an electrochemical reduction reaction to occur at the targetelectrode, near the deposition electrode, which results in thedeposition of material on the target electrode.

Reliable, efficient, and accurate energizing of the deposition electrodepromotes reliable, efficient, and accurate deposition of material on thetarget electrode. Instead of using wires (e.g., traces) and a drivecircuit to activate deposition electrodes, theelectrochemical-deposition system, apparatus, and manufacturing processof the present disclosure alternatively uses electromagnetic radiationto activate the deposition electrodes. Using electromagnetic radiationpromotes smaller deposition electrodes, and thus more precise depositionof material on the target electrode. Additionally, using electromagneticradiation enables larger overall areas of deposition to be deposited onthe target electrode at the same time.

Referring to FIG. 1 , according to some examples, anelectrochemical-deposition system 200 includes a printhead 119 thatincludes an electrode array 113. In some examples, the electrode array113 includes an array of deposition electrodes 102 (see, e.g., FIGS. 2-8). The deposition electrodes 102 of the electrode array 113 areorganized into a matrix arrangement, in some examples, therebysupporting a high resolution of deposition electrodes 102. According tocertain examples, the deposition electrodes 102 of the electrode array113 are arranged into a two-dimensional grid going into and/or comingout of the page, as viewed in FIGS. 2-8 . The deposition electrodes 102are made of any of various electrically conductive materials, such as aplatinum-group metal, copper, a copper alloy, and the like.

Referring to FIGS. 2-8 , the deposition electrodes 102 of the electrodearray 113 are electrically isolated from each other via insulation 126made of an electrically non-conductive material. More specifically, theinsulation 126 is interposed between adjacent ones of the depositionelectrodes 102. Moreover, to promote precision and accuracy, theinsulation 126 can wrap around the outer peripheral edges of theelectrode array 113 to help insulate the outer peripheral edges of theelectrode array 113 from the electrolytic solution 222 and to helpprevent short circuits.

The printhead 119 additionally includes a photoconductor array 115. Thephotoconductor array 115 includes an array of photoconductors 116 (see,e.g., FIGS. 2-11B). The arrangement of the photoconductors 116 of thephotoconductor array 115 complements the arrangement of the depositionelectrodes 102 of the electrode array 113. More specifically, in someexamples, the photoconductors 116 are organized into a matrixarrangement, thereby supporting a high resolution of photoconductors116. In the illustrated example, each one of the photoconductors 116 iselectrically coupled with a corresponding one of the depositionelectrodes 102. According to certain examples, each one of thephotoconductors 116 contacts a corresponding one of the depositionelectrodes 102. More specifically, each one of the photoconductors 116includes an anode terminal, in electrical contact with the correspondingone of the deposition electrodes 102, and a cathode terminal.

Referring to FIGS. 2-11B, the photoconductors 116 of the photoconductorarray 115 are electrically isolated from each other via the insulation126. More specifically, the insulation 126 is interposed betweenadjacent ones of the photoconductors 116. Moreover, to protect thephotoconductors 116 from corrosion, vis-à-vis contact with theelectrolytic solution 222, the insulation 126 can wrap around the outerperipheral edges of the photoconductor array 115 to help insulate theouter peripheral edges of the photoconductor array 115 from theelectrolytic solution 222.

Each one of the photoconductors 116 is any of various electronic devicesthat converts electromagnetic radiation into electric current. Accordingto some examples, the energy or intensity of the electric current isproportional to the energy or intensity of the electromagnetic radiationreceived by the photoconductor 116. In one example, the photoconductoris a photodiode, or other similar semiconductor device, made of asemiconductor material, such as one or more of silicon, germanium,indium gallium arsenide, cadmium sulfide, selenium, lead salts,polyvinylcarbazoles. When photons from the electromagnetic radiation arereceived by the photoconductor 116, a proportional number of electronsmove from the anode terminal to the cathode terminal, thereby creatingan electric current through the photoconductor 116 such that thephotoconductor 116 closes an electric circuit to the depositionelectrode 102. However, when photons, from electromagnetic radiation,are not received by the photoconductor 116, no electric current flowsfrom the anode terminal to the cathode terminal such that thephotoconductor 116 opens the electric circuit to the depositionelectrode 102.

The printhead 110 further includes an electrically conductive layer 104.The electrically conductive layer 104 is electrically coupled with thephotoconductors 116 of the photoconductor array 115. Moreover, theelectrically conductive layer 104 is positioned on the printhead 110 sothat the each one of the photoconductors 116 is electrically interposedbetween the corresponding one of the deposition electrode 102 and theelectrically conductive layer 104. As defined herein, a photoconductor116 is electrically interposed between a deposition electrode 102 and anelectrically conductive layer 104 when the photoconductor 116, thedeposition electrode 102, and the electrically conductive layer 104 areelectrically coupled together so that an electric current is capable offlowing, at least indirectly (e.g., intervening electrical devices orcomponents may be present) from the electrically conductive layer 104 tothe photoconductor 116, and from the photoconductor 116 to thedeposition electrode 102. According to some example, interveningelectrical components include one or more storage capacitorselectrically interposed between the deposition electrodes 102 and thephotoconductors 116. The storage capacitor is configured to store energyso that electric current may be supplied to the deposition electrode 102after the electromagnetic-radiation emitter 108 stops generating theelectromagnetic radiation 140 and after the photoconductor 116 isdeactivated. Examples of a storage capacitor are disclosed in U.S.patent application Ser. No. 17/566,546, filed Dec. 30, 2021, which isincorporated herein by reference in its entirety.

In certain examples, the electrically conductive layer 104 is inelectrical contact with the cathode terminals of the photoconductors116. As shown in FIGS. 2-12 , the electrically conductive layer 104 issupplied with a source of electrical energy at a predetermined constantvoltage Vo. Although the source of electrical energy at thepredetermined constant voltage Vo is shown as a single input on one sideof the printhead 119, in some examples, the source of electrical energyat the predetermined constant voltage Vo can be supplied via multipleinputs on multiple sides of the printhead 119 (e.g., such as when theelectrically conductive layer 104 is not a single continuous sheet, buta mesh of segmented and isolated portions or traces (see, e.g., FIGS. 4and 9 )). In some examples, the source of the electrical energy is anelectric-power source 190 of the system, and the supply of theelectrical energy from the electric-power source 190 to the electricallyconductive layer 104 is controlled by a controller 122, via anelectric-power supply circuit 141.

In some examples, the electrically conductive layer 104 is a single,continuous layer that is electrically coupled with each one of thephotoconductors 116. In other examples, the electrically conductivelayer 104 includes multiple segments made of an electrically conductivematerial that are electrically isolated from each other, so that onesegment is electrically coupled with only a first one or more of thephotoconductors 116 and another segment is electrically coupled withonly a second one or more of the photoconductors 116 (see, e.g., FIG. 9).

The printhead 119 additionally includes at least oneelectromagnetic-radiation emitter 108. The electromagnetic-radiationemitter 108 is configured to generate electromagnetic radiation 140(see, e.g., FIGS. 2-12 ). As described below, the electromagneticradiation 140 can be one of visible light or non-visible light (e.g.,radio, infrared, ultraviolet, x-ray, gamma-ray, etc.). In some examples,the electromagnetic radiation 140 forms a beam of electromagneticradiation 140 Moreover, the electromagnetic-radiation emitter 108 ispositioned and oriented so that, when the electromagnetic radiation 140is generated, at least a portion of the electromagnetic radiation 140illuminates at least one of the photoconductors 116 of thephotoconductor array 115. The electromagnetic-radiation emitter 108 canbe any of various types of electromagnetic-radiation emitters thatgenerates any of various types of electromagnetic-radiation to which acorresponding at least one of the photoconductors 116 is sensitive.According to some examples, the electromagnetic-radiation emitter 108 isone or a combination of a light bulb, light-emitting diode (LED), liquidcrystal display (LCD), digital light processing (DLP) display, organicLED (OLED) display, laser, and the like. Various examples of some ofthese types of electromagnetic-radiation emitters useful in theelectrochemical-deposition apparatus 100 are described in more detail.In some examples, the printhead 119 includes different types ofelectromagnetic-radiation emitters for generating different types ofelectromagnetic-radiation, and different configurations ofphotoconductors with sensitivity to the different types ofelectromagnetic radiation.

In some examples, the electrode array 113, the photoconductor array 115,the electrically conductive layer 104, and/or theelectromagnetic-radiation emitter 108 are stationary relative to eachother, so that as the printhead moves 119 so do the electrode array 113,the photoconductor array 115, the electrically conductive layer 104,and/or the electromagnetic-radiation emitter 108.

The electrochemical-deposition system 200 further includes a targetelectrode 164 and an electrolytic solution 222, which can be containedwithin a partially enclosed container (not shown). In some examples, theelectrolytic solution 222 includes one or more of, but not limited to,plating baths, associated with copper, nickel, tin, silver, gold, lead,etc., and which are typically comprised of water, an acid (such assulfuric acid), metallic salt, and additives (such as levelers,suppressors, surfactants, accelerators, grain refiners, and pH buffers).

In some examples, the electrochemical-deposition system 200 furtherincludes the electric-power supply circuit 141, which, under the controlof the controller, regulates the amount of electric current flowing toeach one of the deposition electrodes 102 of the electrode array 113 byregulating the characteristics of the electromagnetic radiation 140generated by the at least one electromagnetic-radiation emitter 108. Theelectric current, supplied to the deposition electrodes 102, is providedby the electric-power supply circuit 141, which routes power from anelectric-power source 190 of the electrochemical-deposition system 200to the at least one electromagnetic-radiation emitter 108. Although notshown, in some examples, the printhead 119 also includes features, suchas insulation layers, that help protect other features of the printhead119 from the electrolytic solution 222.

The electrochemical-deposition system 200 is configured to move theprinthead 119 relative to the electrolytic solution 222, or to move theelectrolytic solution 222 relative to the printhead 119, such that thedeposition electrodes 102 of the electrode array 113 are at leastpartially submerged in the electrolytic solution 222. When at leastpartially submerged in the electrolytic solution 222, and when electricpower is supplied to at least one of the deposition electrodes 102, anelectrical path (or current) is formed through the electrolytic solution222 from the at least one of the deposition electrodes 102 to aconductive surface 131 of the target electrode 164. In such an example,the target electrode 164 functions as a cathode and the at least one ofthe deposition electrodes 102 functions as an anode of theelectrochemical-deposition apparatus 100. In response to the electricalpath (or current) in the electrolytic solution 222, a layer of material130 is deposited on the conductive surface 131 of the target electrode164 at locations corresponding to the locations of the at least one ofthe deposition electrodes 102. The material 130, which can be one ormore layers of metal, formed by supplying electric current to multipleones of the deposition electrodes 102, forms one or more layers orportions of a part or article, in some examples.

The electrochemical-deposition system 200 supplies electric power fromthe electric-power source 190 to at least one of the depositionelectrodes via selective operation of the electric-power supply circuit141 by the controller 122. The electric-power supply circuit 141 isconfigured to supply electric power, at the predetermined constantvoltage Vo, from the electric-power source 190 to the electricallyconductive layer 104. In certain examples, during operation of theelectrochemical-deposition system 200, the supply of the electric powerto the electrically conductive layer 104 is constant or continuous. Inother words, in certain examples, independent of the activation ordeactivation of the electromagnetic-radiation emitter 108, electricpower is continuously applied to the electrically conductive layer 104,so that the electrically conductive layer 104 is effectively always“ON”. The electric-power supply circuit 141 is also configured to supplyelectric power from the electric-power source 190 to one or moreelectromagnetic-radiation emitters 108. In response to receipt of theelectric power, the electromagnetic-radiation emitters 108 generaterespective amounts (e.g., beams) of electromagnetic radiation 140.

Accordingly, in view of the foregoing, in some examples, the controller122 is configured to direct the electric power to be supplied from theelectric-power source 190 to the electrically conductive layer 104 andto direct the electromagnetic-radiation emitter 108 to generate theelectromagnetic radiation 140 at a first radiation level when theelectric power is supplied to the electrically conductive layer 104.When the electric power is supplied to the electrically conductive layer104 and the electromagnetic radiation 140 is generated at the firstradiation level, so that at least a portion of the electromagneticradiation 140 illuminates the photoconductor 116 to activate thephotoconductor 116, electric current, at a first level or intensitycorresponding with the first radiation level of the electromagneticradiation 140, is established through the photoconductor 116, thedeposition electrode 102, the electrolytic solution 222, and the targetelectrode 164, and a layer of the material 130 is deposited on theconductive surface 131 of the target electrode 164. In some examples,when the electric power is supplied to the electrically conductive layer104, the electromagnetic radiation 140 can be generated at a secondradiation level, different than the first radiation level, so that atleast a portion of the electromagnetic radiation 140 illuminates thephotoconductor 116 to activate the photoconductor 116, electric current,at a second level or intensity, different than the first level orintensity and corresponding with the second radiation level of theelectromagnetic radiation 140, is established through the photoconductor116, the deposition electrode 102, the electrolytic solution 222, andthe target electrode 164, and a layer of the material 130 is depositedon the conductive surface 131 of the target electrode 164. The quantityof the material 130 deposited on the target electrode 164, via theelectric current at the first level, can be different than the quantityof the material 130 deposited on the target electrode 164, via theelectric current at the second level.

When the electromagnetic radiation 140 is not generated, even when theelectric power is supplied to the electrically conductive layer 104, thephotoconductor 116 is not activated and electric current, at a low levelor intensity that is significantly lower than the first or second levelsor intensities, is established through the photoconductor 116 and thedeposition electrode 102, or no electric current is established throughthe photoconductor 116 and the deposition electrode 102, so that nomaterial is deposited on the conductive surface 131 of the targetelectrode 164 at the location of the deposition electrode 102.

Multiple layers, in a stacked formation, at a given location on thetarget electrode 164 can be formed by incrementally moving the printhead119 away from the target electrode 164 and consecutively supplying anelectric current to the one of the deposition electrodes 102corresponding with that location. The material 130 can have an intricateand detailed shape by modifying or alternating the current, flowingthrough the deposition electrodes 102. For example, as shown in FIG. 2 ,first ones of the deposition electrodes 102 are energized, so that thematerial 130 is being deposited near these “energized” ones of thedeposition electrodes 102, when a second one of the depositionelectrodes 102 are not energized, so that the material 130 is not beingdeposited near this “non-energized” one of the deposition electrodes102.

In some examples, the electrochemical-deposition system 200 furtherincludes the controller 122. The printhead 119 is electrically coupledwith the controller 122 via the electric-power supply circuit 141. Morespecifically, the controller 122 can transmit electrical signals to theelectric-power supply circuit 141, and, in response to receipt of theelectrical signals from the controller 122, the electric-power supplycircuit 141 can selectively turn one or more of the depositionelectrodes 102 “ON” or “OFF” (or modify the intensity of electriccurrent flow through the deposition electrodes 102). The controller 122can be, for example and without limitation, a microcontroller, amicroprocessor, a GPU, a FPGA, a SoC, a single-board computer, a laptop,a notebook, a desktop computer, a server, or a network or combination ofany of these devices.

According to certain examples, the electrochemical-deposition system 200additionally includes one or more sensors 123. The controller 122 iselectrically coupled with the sensors 123 to receive feedback signalsfrom the sensors 123. The feedback signals include sensedcharacteristics of the electrochemical-deposition system 200 that enablea determination of the progress of the metal deposition process forforming the material 130. The sensors 123 can be, for example andwithout limitation, current sensors, voltage sensors, timers, cameras,rangefinders, scales, force sensors, and/or pressure sensors.

One or more of the sensors 123 can be used to measure a distance betweenthe printhead 119 and the target electrode 164. Measuring the distancebetween the printhead 119 and the target electrode 164 enables “zeroing”of the printhead 119 relative to the target electrode 164 before thematerial 130 is formed, or setting or confirming the relative positionbetween the printhead 119 and the target electrode 164 before formingeach successive metal layer of the material 130. The accuratepositioning of the printhead 119 and the target electrode 164 at theinitialization of the deposition process can have a significant impacton the success and quality of the completed deposit. In certainexamples, any of various types of sensors for determining the distancebetween the printhead 119 and the target electrode 164 can be used,including, for example and without limitation, mechanical, electrical,or optical sensors, or combinations thereof. In one or more examples,mechanical sensors, such as a pressure sensor, switch, or load cell canbe employed. According to some examples, other types of sensors, such asthose that detect, for example, capacitance, impedance, magnetic fields,or that utilize the Hall Effect, can be used to determine the locationof the printhead 119 relative to the target electrode 164.

Referring to FIG. 1 , the electrochemical-deposition system 200 furtherincludes a mounting system 195 and a positioning system 199, whichincludes a position actuator 124. As shown in the illustrated example,the target electrode 164 is coupled to the position actuator 124, or anadditional or alternative position actuator of the positioning system199, via the mounting system 195. The mounting system 195 is configuredto retain the target electrode 164 and to enable the target electrode164 to be positioned in close proximity to the deposition electrodes 102of the printhead 119. Actuation of the position actuator 124 moves themounting system 195 and the target electrode 164 relative to theprinthead 119 (and thus relative to the deposition electrodes 102).However, in other examples, the printhead 119, rather than the targetelectrode 164, is coupled to the position actuator 124 such thatactuation of the position actuator 124 moves the printhead 119 relativeto the target electrode 164. In yet other examples, both the targetelectrode 164 and the printhead 119 are coupled to the position actuator124, such that actuation of the position actuator 124 results in one ofthe target electrode 164 or the printhead 119 moving relative to theother, or both moving relative to each other.

The position actuator 124 can be a single actuator or multiple actuatorsthat collectively form the position actuator 124. In certain examples,the position actuator 124 controls movement of the target electrode 164relative to the printhead 119, so that the target electrode 164 can bemoved toward or away from the printhead 119, as successive layers ofmaterial 130 are built on the target electrode 164. Alternatively, oradditionally, in some examples, the position actuator 124 controlsmovement of the printhead 119 relative to the target electrode 164, sothat the printhead 119 can be moved toward or away from the targetelectrode 164, as successive layers of the material 130 are built. Inone or more examples, the position actuator 124 also moves the targetelectrode 164 relative to the printhead 119, moves the printhead 119relative to the target electrode 164, or moves both the target electrode164 relative to the printhead 119 and the printhead 119 relative to thetarget electrode 164 so that the printhead 119 and the target electrode164 can be moved relative to each other along respective parallelplanes, which can help when forming parts that have a footprint largerthan the footprint of the electrode array 113.

Although not shown with particularity in FIG. 1 , in one or moreexamples, the electrochemical-deposition system 200 includes afluid-handling system. The fluid-handling system can include, forexample, a tank, a particulate filter, chemically resistant tubing, anda pump. The electrochemical-deposition system 200 can further includeanalytical equipment that enables continuous characterization of bathpH, temperature, and ion concentration of the electrolytic solution 222using methods such as conductivity, high-performance liquidchromatography, mass spectrometry, cyclic voltammetry stripping,spectrophotometer measurements, or the like. Bath conditions of theelectrolytic solution 222 can be maintained with a chiller, heater,and/or an automated replenishment system to replace solution lost toevaporation and/or ions of deposited material.

Although the electrochemical-deposition system 200, shown in FIG. 1 ,has a single printhead with a single electrode array, in one or morealternative examples, the electrochemical-deposition system 200comprises multiple printheads, each with one or more electrode arrays,or a single printhead with multiple electrode arrays. In one or moreexamples, these multiple electrode arrays operate simultaneously indifferent chambers, filled with the same or different electrolyticsolutions, or are arranged so that the electrode arrays work together todeposit material on a shared target electrode or series of targetelectrodes.

Referring to FIG. 2 , according to one example, the electricallyconductive layer 104 is interposed between the electromagnetic-radiationemitter 108 and the photoconductor 116, so that, when theelectromagnetic radiation 140 is generated, at least a portion of theelectromagnetic radiation 140 reaches the electrically conductive layer104 before reaching the photoconductor 116. In such an example, theelectromagnetic radiation 140 passes through the electrically conductivelayer 104 before illuminating (e.g., impacting) the photoconductor 116.The electrically conductive layer 104 can be at least partiallytransparent to the electromagnetic radiation 140. For example, as shownin FIG. 2 , in certain examples, the electrically conductive layer 104includes an electrically conductive material 106, such as semiconductingoxides of tin, indium, zinc, and cadmium, and metals (e.g., silver,gold, and titanium nitride), that is at least partially transparent tothe electromagnetic radiation 140. In one example, the electromagneticradiation 140 is a light (e.g., visible light or non-visible light) andthe electrically conductive material 106 is transparent to the light.The electrically conductive material 106 is in electrical contact withthe cathode terminals of the photoconductors 116.

According to some examples, the electrically conductive layer 104 hasmultiple layers or sub-layers. In the examples shown in FIGS. 2-9 , theelectrically conductive layer 104 includes the electrically conductivematerial 106 and an electrically non-conductive substrate 114. Theelectrically conductive layer 104 is coupled with (e.g., applied onto,deposited onto, adhered to, etc.) the non-conductive substrate 114. Thenon-conductive substrate 114 promotes rigidity of the electricallyconductive layer 104, electrically isolates the electrically conductivematerial 106, and supports the electrically conductive material 106.According to certain examples, as shown in FIG. 2 , the electricallynon-conductive substrate 114 is interposed between the electricallyconductive material 106 and the electromagnetic-radiation emitter 108 sothat, when generated, the electromagnetic radiation 140 passes throughthe electrically non-conductive substrate 114 before passing through theelectrically conductive material 106 and illuminating the photoconductor116. In some examples, the electrically non-conductive substrate 114 ismade of an electrically non-conductive material, such as a polymer,glass, acrylic, and the like, that is at least partially transparent(fully transparent, in some examples) to the electromagnetic radiation140.

Referring to FIG. 2 , and according to one example of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. The electrically conductive material106 of the electrically conductive layer 104 is in electrical contactwith each one of the three photoconductors 116 and is receiving electricpower at the predetermined constant voltage Vo. When the electricallyconductive material 106 is a single, continuous layer, in certainexamples, the electrically conductive material 106 forms a sheet.

The controller 122 controls the electromagnetic-radiation emitter 108 togenerate the electromagnetic radiation 140. At least a portion of theelectromagnetic radiation 140 passes through the electricallynon-conductive substrate 114 and the electrically conductive material106 before illuminating one of the three photoconductors 116. Theintensity of the electromagnetic radiation 140 is sufficient to activatethe photoconductor 116, which effectively changes the photoconductor 116from an electrically non-conducting state to an electrically conductingstate, which permits electric current, from the electrically conductivematerial 106, to flow to the one of the three deposition electrodes 102and through the electrolytic solution 222, as indicated by a soliddirectional arrow. The electric current flowing through electrolyticsolution 222 results in the deposition of the material 130 onto thetarget electrode 164. Because the electromagnetic radiation 140 does notilluminate the second or third ones of the three photoconductors 116,the second and third ones of the photoconductors 116 remain in adeactivated or electrically non-conducting state, so that no electriccurrent or a reduced level of electric current flows through the thirddeposition electrode 102, as indicated by a dashed directional arrow,and no material is deposited onto the target electrode 164 at thelocation of the second and third ones of the deposition electrodes 102.

Referring to FIG. 3 , according to another example of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. Like the electrochemical-depositionapparatus 100 of FIG. 2 , the electromagnetic-radiation emitter 108generates the electromagnetic radiation 140. However, unlike theelectrochemical-deposition apparatus 100 of FIG. 2 , the electromagneticradiation 140 is configured to pass through the electricallynon-conductive substrate 114 and the electrically conductive material106 before illuminating more than one (e.g., two) of the threephotoconductors 116. The intensity of the electromagnetic radiation 140is sufficient to activate at least two of the photoconductors 116illuminated by the electromagnetic radiation 140, which permits electriccurrent from the electrically conductive material 106 to flow to thecorresponding deposition electrodes 102 and through the electrolyticsolution 222, as indicated by solid directional arrows, so that thematerial 130 is deposited onto the target electrode 164 at the locationof the corresponding deposition electrode 102. Because theelectromagnetic radiation 140 does not illuminate one of the threephotoconductors 116, this photoconductor 116 is not activated, such thatno electric current or a significantly reduced level of electric currentflows through it, as indicated by a dashed directional arrow, and nomaterial is deposited onto the target electrode 164 at the location ofthis deposition electrode 102.

In the illustrated example of FIG. 3 , the material 130 deposited at thelocation of a first one of the deposition electrodes 102 (e.g., a leftone of the deposition electrodes 102) is an initial layer of materialdeposited onto the conductive surface 131 of the target electrode 164,and the material 130 deposited at the location of a second one of thedeposition electrodes 102 (e.g., a middle one of the depositionelectrodes 102) is a subsequent layer of material applied onto apreviously deposited layer 133 of material, indicated by dashed lines.Although not shown in FIG. 3 , the material 130 deposited by the firstone of the deposition electrodes 102 could also be deposited onto apreviously deposited layer and/or the material 130 deposited by thesecond one of the deposition electrodes 102 could be an initial layer ofmaterial deposited onto the conductive surface 131.

In some examples, the electrochemical-deposition apparatuses 100 ofFIGS. 2 and 3 are the same. In other words, in some examples, theelectromagnetic-radiation emitter 108 is selectively adjustable toadjust the coverage, orientation, position, and/or the intensity of theelectromagnetic radiation 140, so that a different one or ones of thephotoconductors 116 are illuminated and activated. For example, thecoverage of the electromagnetic radiation 140 of FIG. 2 is narrowed(e.g., smaller beam angle) relative to the electromagnetic radiation 140of FIG. 3 , so that fewer of the photoconductors 116 in FIG. 2 areactivated.

Referring to FIG. 4 , according to another example of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. Like the electrochemical-depositionapparatus 100 of FIG. 2 , the electromagnetic-radiation emitter 108generates electromagnetic radiation 140 that illuminates two of thethree deposition electrodes 102. However, unlike theelectrochemical-deposition apparatus 100 of FIG. 2 , the electricallyconductive material 106 includes material that is not transparent to theelectromagnetic radiation 140. Instead, the electrically conductivematerial 106 includes apertures 142 that are spaced-apart from eachother and positioned in alignment corresponding ones of thephotoconductors 116. The electromagnetic radiation 140 is thus passablethrough the electrically conductive material 106 via one or more of theapertures 142. Accordingly, when the electromagnetic radiation 140 isdirected towards the electrically conductive material 106, only theportion of the electromagnetic radiation 140 passing through theapertures 142 illuminates the photoconductors 116. In this manner, thephotoconductors 116 that are illuminated by electromagnetic radiation140 can be more precisely controlled without precisely controlling thecoverage of the electromagnetic radiation 140. In some examples, theelectrically conductive material 106 is a single continuous part and theapertures 142 are circumferentially closed through-holes formed in thepart. However, in other examples, the electrically conductive material106 includes multiple spaced-apart segments or traces of a mesh, wherethe segments are electrically isolated from each other and each receiveselectric energy independently of each other, and the apertures 142 aredefined as the gaps between adjacent ones of the multiple spaced-apartsegments or traces.

Referring to FIG. 5 , according to another example of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. The electromagnetic-radiationemitter 108 of FIG. 5 includes a display panel 152 and a backlightsource 150. The display panel 152 includes a plurality ofelectromagnetic-radiation-generating elements, which, in the example ofFIG. 5 , include a plurality of liquid crystal elements 154. Each one ofthe liquid crystal elements 154 includes a liquid crystal material thatis selectively activatable to permit light to pass through. The displaypanel 152 includes electronic circuitry that enables selectiveactivation and deactivation of the liquid crystal elements 154.

According to the example of FIG. 5 , each one of the liquid crystalelements 154 is selectively activated, so that light generated by thebacklight source 150 passes through the liquid crystal element 154. Incontrast, each one of the liquid crystal elements 154 is selectivelydeactivated, so that light, generated by the backlight source 150, doesnot pass through the liquid crystal element 154. The backlight source150 can include any number of light generating devices, such aslight-emitting diodes (LED), lightbulbs, and the like.

As shown in FIG. 5 , when a liquid crystal element 154 is activated, thelight passing through the element illuminates a corresponding one of thephotoconductors 116 so the photoconductor 116 is activated to enable thepassage of electric current to the corresponding one of the depositionelectrodes 102. The liquid crystal element 154 associated with two ofthe three photoconductors 116 is activated, as indicated by soliddirectional arrows, and the liquid crystal element 154 associated with athird of the three photoconductors 116 is deactivated, as indicated by adashed directional arrow.

In some examples of the electrochemical-deposition apparatus 100 of FIG.5 , the transparency of the liquid crystal elements 154 is adjustable toadjust the intensity of the light passed therethrough. Moreover, theelectric current passed through the photoconductors 116 can vary basedon the intensity of the light received by the photoconductors 116. Inthis manner, the magnitude of the electric current passing through thedeposition electrode 102, the electrolytic solution 222, and the targetelectrode 164 can be adjusted by adjusting the intensity of the lightreceived by the photoconductors 116. Because the quantity of thematerial 130 deposited onto the target electrode 164 is proportional tothe magnitude of the electric current passing through the depositionelectrode 102, the electrolytic solution 222, and the target electrode164, adjusting the intensity of the light received at thephotoconductors 116 can adjust the quantity of the material 130deposited onto the target electrode 164 at locations corresponding withthe deposition electrode 102. Accordingly, the rate or quantity of thematerial 130 deposited onto the target electrode 164 can vary bycontrolling the transparency of the liquid crystal elements 154.Additionally, the rate or quantity of the material 130 deposited ontothe target electrode 164 can vary from location to location byselectively controlling the transparency of one of the liquid crystalelements 154 relative to another one of the liquid crystal elements 154.

Analogous to varying the intensity of the electromagnetic radiation byvarying the transparency of the liquid crystal elements 154, in someexamples, the intensity of the electromagnetic radiation generated byother types of electromagnetic-radiation emitters described herein canbe varied to change the rate or quantity of the material 130 depositedonto the target electrode 164. Moreover, in the examples having multipleelectromagnetic-radiation emitters or multipleelectromagnetic-radiation-generating elements, the intensity of theelectromagnetic radiation generated by one of the multipleelectromagnetic-radiation emitters or multipleelectromagnetic-radiation-generating elements can be adjusted to bedifferent than the intensity of the electromagnetic radiation generatedby at least another one of the multiple electromagnetic-radiationemitters or multiple electromagnetic-radiation-generating elements, sothat the rate or quantity of the material 130 deposited at one locationon the target electrode 164 is different than at another location orlocations on the target electrode 164.

Referring to FIG. 6 , according to another example of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. The electromagnetic-radiationemitter 108 of FIG. 6 includes a display panel 152 having a plurality ofelectromagnetic-radiation-generating elements. In the example shown inFIG. 6 , each one of the electromagnetic-radiation-generating elementsis a self-illuminating light source 155, such as an LED, an organiclight-emitting diode (OLED), a plasma cell, and the like, which isselectively activatable to generate electromagnetic radiation 140. Thedisplay panel 152 includes electronic circuitry that enables activationand deactivation of the self-illuminating light source 155.

As shown in FIG. 6 , when a self-illuminating light source 155 isactivated, the light generated by the self-illuminating light source 155illuminates a corresponding one of the photoconductors 116 so thephotoconductor 116 is activated to enable the passage of electriccurrent to the corresponding one of the deposition electrodes 102. Theself-illuminating light source 155 associated with two of the threephotoconductors 116 is activated, as indicated by solid directionalarrows, and the self-illuminating light source 155 associated with athird of the three photoconductors 116 is deactivated, as indicated by adashed directional arrow.

In some examples of the electrochemical-deposition apparatus 100 of FIG.6 , the intensity of the electromagnetic radiation 140 generated by theself-illuminating light sources 155 is adjustable relative to eachother. Accordingly, in accordance with the foregoing description, thequantity of the material 130 deposited onto the target electrode 164 canvary by controlling the intensity of the electromagnetic radiation 140generated by the self-illuminating light sources 155. Additionally, thequantity of the material 130 deposited onto the target electrode 164 canvary from location to location by selectively controlling the intensityof the electromagnetic radiation 140 generated by one of theself-illuminating light sources 155 relative to another one of theself-illuminating light sources 155.

Referring to FIG. 7 , according to some examples of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. The electrochemical-depositionapparatus 100 of FIG. 7 includes multiple electromagnetic-radiationemitters 108 each configured to generate a separate amount (e.g., beam)of electromagnetic radiation 140. In the illustrated embodiment, eachone of the electromagnetic-radiation emitters 108 is associated with acorresponding one of the photoconductors 116. In other words, theelectromagnetic radiation 140 generated by each one of the each one ofthe electromagnetic-radiation emitters 108 is configured to illuminate acorresponding one of the photoconductors 116. However, in otherexamples, each one of the electromagnetic-radiation emitters 108 isassociated with a corresponding two or more of the photoconductors 116.According to one example, each one of the electromagnetic-radiationemitters 108 is a laser and each one of the amounts of electromagneticradiation 140 is a laser beam.

In certain examples, each one of the electromagnetic-radiation emitters108 is selectively operable independently of any other one of theelectromagnetic-radiation emitters 108. The electromagnetic-radiationemitters 108 are electrically coupled with the electric-power source 190via the electric-power supply circuit 141. The controller 122 isconfigured to control activation of switches of the electric-powersupply circuit 141 to selectively activate one or more of theelectromagnetic-radiation emitters 108. It is recognized that the sameconfiguration of the electric-power supply circuit 141 shown in FIG. 7can be applied to control the multipleelectromagnetic-radiation-generating elements of FIGS. 5 and 6 .

In some examples of the electrochemical-deposition apparatus 100 havingmultiple, independently and selectively operable,electromagnetic-radiation emitters 108 orelectromagnetic-radiation-generating elements of anelectromagnetic-radiation emitter 108, mapping of the electric currentbeing passed through different regions or groupings of depositionelectrodes 102 may be performed. The deposition electrodes 102 of theelectrode array 113 may be separated into different regions viadifferent voltage busses. The electromagnetic-radiation emitters 108 orelectromagnetic-radiation-generating elements associated with thedifferent regions may be individually activated to individuallyilluminate the photoconductor or photoconductors associated with thedifferent regions. When the photoconductor or photoconductors associatedwith a region are activated, the electric current passing through thedeposition electrodes 120 associated with that region can be measuredand mapped.

Referring to FIG. 8A, according to some examples of theelectrochemical-deposition apparatus 100, three deposition electrodes102 of the electrode array 113 and three photoconductors 116 of thephotoconductor array 115 are shown. The electrochemical-depositionapparatus 100 of FIG. 8 includes an electromagnetic-radiation emitter108 that is movable, relative to the photoconductor array 115. Morespecifically, the electromagnetic-radiation emitter 108 is movablebetween, and inclusive of, multiple positions each corresponding withone of the photoconductors 116 of the photoconductor array 115. When ina first position, of the multiple positions, the electromagneticradiation 140 generated by the electromagnetic-radiation emitter 108illuminates a first one of the photoconductors 116. In contrast, in asecond position, of the multiple positions, the electromagneticradiation 140 generated by the electromagnetic-radiation emitter 108illuminates a first one of the photoconductors 116. In this manner, thephotoconductors 116 can be selectively and separately activated bymoving the electromagnetic-radiation emitter 108 from position toposition. Although not shown, the electrochemical-deposition apparatus100 can include a positioning system (e.g., an actuator), controllableby the controller 122, that moves the electromagnetic-radiation emitter108 between positions. Moreover, although only oneelectromagnetic-radiation emitter 108 is shown in FIG. 8 , in someexamples, the electrochemical-deposition apparatus 100 can includemultiple electromagnetic-radiation emitters 108 each movable relative tothe photoconductor array 115 and relative to the otherelectromagnetic-radiation emitters 108. Although theelectromagnetic-radiation emitter 108 of FIG. 8A is shown to betranslationally movable from position to position, in other examples,the electromagnetic-radiation emitter 108 is rotationally movable fromposition to position (e.g., from orientation to orientation).

Referring to FIG. 8B, in some examples, the electrochemical-depositionapparatus 100 includes an adjustable mirror 192, which receiveselectromagnetic radiation 140 from an electromagnetic-radiation emitter108. The electromagnetic-radiation emitter 108 is fixed relative to theelectrode array 113 and the photoconductor array 115 and is configuredto generate and direct the electromagnetic radiation 140 toward theadjustable mirror 192. The adjustable mirror 192 includes a reflectivesurface that reflects the electromagnetic radiation 140 toward one ormore of the photoconductors 116 of the photoconductor array 115. Theangle of the reflective surface is adjustable (e.g., rotatable) relativeto the electromagnetic-radiation emitter to adjust the direction of theelectromagnetic radiation 140 reflected off the reflective surface. Inone example, the controller 122 controls the adjustable mirror 192 todirect the electromagnetic radiation 140 to desired one or more of thephotoconductors 116, resulting in the deposition of the material 130onto the target electrode 164 at a location corresponding with thedesired one or more of the photoconductors 116. The location at whichthe material 130 is deposited can be adjusted to a second location byadjusting the adjustable mirror 192 to direct the electromagneticradiation 140 to another one or more of the photoconductors 116corresponding with the second location.

As shown in FIG. 9 , according to some examples of theelectrochemical-deposition apparatus 100, the electrically conductivematerial 106 is not interposed between the electromagnetic-radiationemitter 108 and the photoconductor 116. Instead, in theelectrochemical-deposition apparatus 100 of FIG. 9 , the electricallyconductive material 106, the photoconductor 116, and the depositionelectrode 102 are arranged in a side-by-side manner along a planeparallel to the conductive surface 131 of the target electrode. Thephotoconductor 116 is still electrically interposed between theelectrically conductive material 106 and the deposition electrode 102.However, the electromagnetic radiation 140 generated by theelectromagnetic-radiation emitter 108 need not pass through theelectrically conductive material 106 to illuminate the photoconductor116, activate the photoconductor 116, and establish an electric current,from the electrically conductive material 106, through thephotoconductor 116, and through the deposition electrode 102. Theinsulation 126 insulates the electrically conductive material 106 sothat the electrically conductive material 106 is physically isolatedfrom the electrolytic solution 222 during electrodeposition of thematerial 130 on the target electrode 164. In some examples, thedeposition electrode 102, the photoconductor 116, and the electricallyconductive material 106 are supported on an electrically non-conductivesubstrate 114, which can be at least partially transparent to theelectromagnetic radiation 140 in a manner as described above.

Referring to FIG. 10 , according to another example of theelectrochemical-deposition apparatus 100, in which the electricallyconductive material 106 is not interposed between theelectromagnetic-radiation emitter 108 and the photoconductor 116, theelectrically conductive material 106 is arranged such that theelectrically conductive material 106 is interposed between thephotoconductor 116 and the target electrode 164. Depending on theorientation of the printhead 119, the electrically conductive material106 can be above the photoconductor 116 (e.g., when the printhead 119 isbelow the target electrode 164). The insulation 126 insulates theelectrically conductive material 106 so that the electrically conductivematerial 106 is physically isolated from the electrolytic solution 222during electrodeposition of the material 130 on the target electrode164. The deposition electrode 102 and the photoconductor 116 may stillbe arranged in a side-by-side manner along a plane parallel to theconductive surface 131 of the target electrode. The photoconductor 116is still electrically interposed between the electrically conductivematerial 106 and the deposition electrode 102. However, like theelectrochemical-deposition apparatus 100 of FIG. 9 , the electromagneticradiation 140 generated by the electromagnetic-radiation emitter 108need not pass through the electrically conductive material 106 toilluminate the photoconductor 116, activate the photoconductor 116, andestablish an electric current, from the electrically conductive material106, through the photoconductor 116, and through the depositionelectrode 102.

Referring to FIGS. 11A and 11B, in some examples, theelectrochemical-deposition apparatus 100 utilizes a photomask to directelectromagnetic radiation only to a desired one or more photoconductors116. The photomask includes a portion or portions that block thetransmission of the electromagnetic radiation 140 and a portion orportions that permit the transmission of the electromagnetic radiation140 through the photomask.

As shown in FIG. 11A, a photomask 180A includes two pass-throughportions 182, which can be apertures, an at least partially transparentmaterial, etc. in some examples. The pass-through portions 182 permitthe electromagnetic radiation 140 generated by theelectromagnetic-radiation emitter 108 to pass through the photomask180A. The photomask 180A is interposed between the photoconductors 116and the electromagnetic-radiation emitter 108. The position of thephotomask 180A relative to the electromagnetic-radiation emitter 108,size of the pass-through portions 182, and location of the pass-throughportions 182 on the photomask 180A dictate the intensity and thedirectionality of the electromagnetic radiation 140 passing through thepass-through portions 182. In this manner, the photomask 180A isconfigured so that the electromagnetic radiation 140 passing through thepass-through portions 182 illuminates only the photoconductor 116 or thephotoconductors 116 that will result in the deposition of material 130on the target electrode 164 at a desired location, rate, and quantity.In the example of FIG. 11A, the two pass-through portions 182 enableportions of the electromagnetic radiation 140 to illuminate only two ofthe three photoconductors 116.

In contrast, the photomask 180B has one pass-through portion 182 sizedand located so that the portion of the electromagnetic radiation 140passing through the pass-through portion 182 illuminates only one of thethree photoconductors 116. In some examples, theelectrochemical-deposition apparatus 100 includes multiple photomasksthat are interchangeable or switchable with each other to depositmultiple layers on the target electrode 164, each having a differentpattern.

Now referring to FIG. 12 , in some examples, theelectrochemical-deposition apparatus 100 includes a photoconductor 116that is electrically coupled with multiple deposition electrodes 102.According to one example, the photoconductor 116 is a sheet made of aphotoconductive material.

In one example of the electrochemical-deposition apparatus 100 of FIG.12 , which is not shown, when electromagnetic radiation illuminates anyportion of the photoconductor 116, an electric current is establishedthrough the photoconductor 116 and each one of the deposition electrodes102 electrically coupled with the photoconductor 116. In this manner, asingle photoconductor 116 enables the deposition of the material 130onto multiple locations of the target electrode 164 corresponding withthe locations of the deposition electrodes 102.

However, in another example of the electrochemical-deposition apparatus100 of FIG. 12 , which is shown, when electromagnetic radiationilluminates just a portion of the photoconductor 116, an electriccurrent is established only through that portion of the photoconductor116, so that an electric current is established in only the depositionelectrode(s) 102 electrically coupled to that portion of thephotoconductor 116. In such a configuration, the photoconductivematerial of the photoconductor 116 is selected so that electricalconductivity in a lateral direction is restricted. In this manner, asingle photoconductor 116 can enable the deposition of the material 130onto locations of the target electrode 164 corresponding with less thanall of the locations of the deposition electrodes 102 electricallycoupled with the photoconductor 116.

Referring to FIG. 13 , according to one example, a method 300 ofelectroplating a target electrode 164 is shown. The method 300 includes(block 310) establishing direct physical contact between a surface ofthe target electrode 164 and the electrolytic solution 222. The method300 also includes (block 320) establishing direct physical contactbetween a surface of the deposition electrode 102 and the electrolyticsolution 222. The method 300 further includes (block 330) supplyingelectric power to the electrically conductive layer 104. The method 300additionally includes (block 340) delivering at least a portion of theelectromagnetic radiation 140 to the photoconductor 116, so that anelectric current is established through the electrically conductivelayer 104, the photoconductor 116, the deposition electrode 102, theelectrolytic solution 222, and the target electrode 164, and so that aquantity of the electrically charged material in the electrolyticsolution 222 is electroplated onto at least a portion of the surface ofthe target electrode 164 in direct physical contact with theelectrolytic solution 222.

According to some examples of the method 300, the step of establishingdirect physical contact between a surface of the deposition electrode102 and the electrolytic solution 222 includes establishing directphysical contact between surfaces of a plurality of depositionelectrodes 102 and the electrolytic solution 222. Also, the step ofdelivering the at least the portion of the electromagnetic radiation 140to the photoconductor 116 comprises delivering the at least the portionof the electromagnetic radiation 140 to at least two of a plurality ofphotoconductors 116 or delivering a plurality of amounts ofelectromagnetic radiation 140 to a corresponding one or multiple ones ofthe plurality of photoconductors 116.

In certain examples of the method 300, the step of delivering the atleast the portion of the electromagnetic radiation 140 to thephotoconductor 116 includes adjusting at least one of an intensity or aquantity of the at least the portion of the electromagnetic radiation140 delivered to the photoconductor 116 so that an amplitude (e.g.,intensity) of the electric current, established through the electricallyconductive layer 104, the photoconductor 116, the deposition electrode102, the electrolytic solution 222, and the target electrode 164, isadjusted, and the quantity of the electrically charged materialelectroplated onto the at least the portion of the surface of the targetelectrode 164 is adjusted.

According to some examples of the method 300, the step of delivering theat least the portion of the electromagnetic radiation 140 furtherincludes passing the at least the portion of the electromagneticradiation 140 through the electrically conductive layer 104 beforedelivering the at least the portion of the electromagnetic radiation 140to the photoconductor 116.

Other features and steps of the electrochemical-deposition system 200and the method 300, respectively, can be found in U.S. patentapplication Ser. No. 17/112,909, filed December 2020, which isincorporated herein by reference in its entirety.

In the above description, certain terms may be used such as “up,”“down,” “upper,” “lower,” “horizontal,” “vertical,” “left,” “right,”“over,” “under” and the like. These terms are used, where applicable, toprovide some clarity of description when dealing with relativerelationships. But, these terms are not intended to imply absoluterelationships, positions, and/or orientations. For example, with respectto an object, an “upper” surface can become a “lower” surface simply byturning the object over. Nevertheless, it is still the same object.Further, the terms “including,” “comprising,” “having,” and variationsthereof mean “including but not limited to” unless expressly specifiedotherwise. An enumerated listing of items does not imply that any or allof the items are mutually exclusive and/or mutually inclusive, unlessexpressly specified otherwise. The terms “a,” “an,” and “the” also referto “one or more” unless expressly specified otherwise. Further, the term“plurality” can be defined as “at least two.” Moreover, unless otherwisenoted, as defined herein a plurality of particular features does notnecessarily mean every particular feature of an entire set or class ofthe particular features.

Additionally, instances in this specification where one element is“coupled” to another element can include direct and indirect coupling.Direct coupling can be defined as one element coupled to and in somecontact with another element. Indirect coupling can be defined ascoupling between two elements not in direct contact with each other, buthaving one or more additional elements between the coupled elements.Further, as used herein, securing one element to another element caninclude direct securing and indirect securing. Additionally, as usedherein, “adjacent” does not necessarily denote contact. For example, oneelement can be adjacent another element without being in contact withthat element.

As used herein, the phrase “at least one of”, when used with a list ofitems, means different combinations of one or more of the listed itemsmay be used and only one of the items in the list may be needed. Theitem may be a particular object, thing, or category. In other words, “atleast one of” means any combination of items or number of items may beused from the list, but not all of the items in the list may berequired. For example, “at least one of item A, item B, and item C” maymean item A; item A and item B; item B; item A, item B, and item C; oritem B and item C. In some cases, “at least one of item A, item B, anditem C” may mean, for example, without limitation, two of item A, one ofitem B, and ten of item C; four of item B and seven of item C; or someother suitable combination.

Unless otherwise indicated, the terms “first,” “second,” etc. are usedherein merely as labels, and are not intended to impose ordinal,positional, or hierarchical requirements on the items to which theseterms refer. Moreover, reference to, e.g., a “second” item does notrequire or preclude the existence of, e.g., a “first” or lower-numbereditem, and/or, e.g., a “third” or higher-numbered item.

As used herein, a system, apparatus, structure, article, element,component, or hardware “configured to” perform a specified function isindeed capable of performing the specified function without anyalteration, rather than merely having potential to perform the specifiedfunction after further modification. In other words, the system,apparatus, structure, article, element, component, or hardware“configured to” perform a specified function is specifically selected,created, implemented, utilized, programmed, and/or designed for thepurpose of performing the specified function. As used herein,“configured to” denotes existing characteristics of a system, apparatus,structure, article, element, component, or hardware which enable thesystem, apparatus, structure, article, element, component, or hardwareto perform the specified function without further modification. Forpurposes of this disclosure, a system, apparatus, structure, article,element, component, or hardware described as being “configured to”perform a particular function may additionally or alternatively bedescribed as being “adapted to” and/or as being “operative to” performthat function.

The schematic flow chart diagram included herein is generally set forthas logical flow chart diagram. As such, the depicted order and labeledsteps are indicative of one example of the presented method. Other stepsand methods may be conceived that are equivalent in function, logic, oreffect to one or more steps, or portions thereof, of the illustratedmethod. Additionally, the format and symbols employed are provided toexplain the logical steps of the method and are understood not to limitthe scope of the method. Although various arrow types and line types maybe employed in the flow chart diagrams, they are understood not to limitthe scope of the corresponding method. Indeed, some arrows or otherconnectors may be used to indicate only the logical flow of the method.For instance, an arrow may indicate a waiting or monitoring period ofunspecified duration between enumerated steps of the depicted method.Additionally, the order in which a particular method occurs may or maynot strictly adhere to the order of the corresponding steps shown.Blocks represented by dashed lines indicate alternative operationsand/or portions thereof. Dashed lines, if any, connecting the variousblocks represent alternative dependencies of the operations or portionsthereof. It will be understood that not all dependencies among thevarious disclosed operations are necessarily represented.

Many of the functional units described in this specification have beenlabeled as modules, in order to more particularly emphasize theirimplementation independence. For example, a module may be implemented asa hardware circuit comprising custom VLSI circuits or gate arrays,off-the-shelf semiconductors such as logic chips, transistors, or otherdiscrete components. A module may also be implemented in programmablehardware devices such as field programmable gate arrays, programmablearray logic, programmable logic devices or the like.

Modules may also be implemented in code and/or software for execution byvarious types of processors. An identified module of code may, forinstance, comprise one or more physical or logical blocks of executablecode which may, for instance, be organized as an object, procedure, orfunction. Nevertheless, the executables of an identified module need notbe physically located together, but may comprise disparate instructionsstored in different locations which, when joined logically together,comprise the module and achieve the stated purpose for the module.

Indeed, a module of code may be a single instruction, or manyinstructions, and may even be distributed over several different codesegments, among different programs, and across several memory devices.Similarly, operational data may be identified and illustrated hereinwithin modules, and may be embodied in any suitable form and organizedwithin any suitable type of data structure. The operational data may becollected as a single data set, or may be distributed over differentlocations including over different computer readable storage devices.Where a module or portions of a module are implemented in software, thesoftware portions are stored on one or more computer readable storagedevices.

Any combination of one or more computer readable medium may be utilized.The computer readable medium may be a computer readable storage medium.The computer readable storage medium may be a storage device storing thecode. The storage device may be, for example, but not limited to, anelectronic, magnetic, optical, electromagnetic, infrared, holographic,micromechanical, or semiconductor system, apparatus, or device, or anysuitable combination of the foregoing.

More specific examples (a non-exhaustive list) of the storage devicewould include the following: an electrical connection having one or morewires, a portable computer diskette, a hard disk, a random access memory(RAM), a read-only memory (ROM), an erasable programmable read-onlymemory (EPROM or Flash memory), a portable compact disc read-only memory(CD-ROM), an optical storage device, a magnetic storage device, or anysuitable combination of the foregoing. In the context of this document,a computer readable storage medium may be any tangible medium that cancontain, or store a program for use by or in connection with aninstruction execution system, apparatus, or device.

Code for carrying out operations for examples may be written in anycombination of one or more programming languages including an objectoriented programming language such as Python, Ruby, Java, Smalltalk,C++, or the like, and conventional procedural programming languages,such as the “C” programming language, or the like, and/or machinelanguages such as assembly languages. The code may execute entirely onthe user's computer, partly on the user's computer, as a stand-alonesoftware package, partly on the user's computer and partly on a remotecomputer or entirely on the remote computer or server. In the latterscenario, the remote computer may be connected to the user's computerthrough any type of network, including a local area network (LAN) or awide area network (WAN), or the connection may be made to an externalcomputer (for example, through the Internet using an Internet ServiceProvider).

The described features, structures, or characteristics of the examplesmay be combined in any suitable manner. In the above description,numerous specific details are provided, such as examples of programming,software modules, user selections, network transactions, databasequeries, database structures, hardware modules, hardware circuits,hardware chips, etc., to provide a thorough understanding of examples.One skilled in the relevant art will recognize, however, that examplesmay be practiced without one or more of the specific details, or withother methods, components, materials, and so forth. In other instances,well-known structures, materials, or operations are not shown ordescribed in detail to avoid obscuring aspects of an example.

Aspects of the examples are described above with reference to schematicflowchart diagrams and/or schematic block diagrams of methods,apparatuses, systems, and program products according to examples. Itwill be understood that each block of the schematic flowchart diagramsand/or schematic block diagrams, and combinations of blocks in theschematic flowchart diagrams and/or schematic block diagrams, can beimplemented by code. These code may be provided to a processor of ageneral purpose computer, special purpose computer, or otherprogrammable data processing apparatus to produce a machine, such thatthe instructions, which execute via the processor of the computer orother programmable data processing apparatus, create means forimplementing the functions/acts specified in the schematic flowchartdiagrams and/or schematic block diagrams block or blocks.

The code may also be stored in a storage device that can direct acomputer, other programmable data processing apparatus, or other devicesto function in a particular manner, such that the instructions stored inthe storage device produce an article of manufacture includinginstructions which implement the function/act specified in the schematicflowchart diagrams and/or schematic block diagrams block or blocks.

The code may also be loaded onto a computer, other programmable dataprocessing apparatus, or other devices to cause a series of operationalsteps to be performed on the computer, other programmable apparatus orother devices to produce a computer implemented process such that thecode which execute on the computer or other programmable apparatusprovide processes for implementing the functions/acts specified in theflowchart and/or block diagram block or blocks.

The schematic flowchart diagrams and/or schematic block diagrams in thefigures illustrate the architecture, functionality, and operation ofpossible implementations of apparatuses, systems, methods and programproducts according to various examples. In this regard, each block inthe schematic flowchart diagrams and/or schematic block diagrams mayrepresent a module, segment, or portion of code, which comprises one ormore executable instructions of the code for implementing the specifiedlogical function(s).

The present subject matter may be embodied in other specific formswithout departing from its spirit or essential characteristics. Thedescribed examples are to be considered in all respects only asillustrative and not restrictive. All changes which come within themeaning and range of equivalency of the claims are to be embraced withintheir scope.

What is claimed is:
 1. An electrochemical-deposition apparatus,comprising: an electrode array, comprising deposition electrodes; aphotoconductor, electrically coupled with at least one of the depositionelectrodes; an electrically conductive layer, electrically coupled withthe photoconductor and positioned so that the photoconductor iselectrically interposed between the at least one deposition electrodeand the electrically conductive layer; an electromagnetic-radiationemitter, configured to generate electromagnetic radiation and positionedso that when generated, at least a portion of the electromagneticradiation illuminates the photoconductor; an electric-power source,configured to supply electric power to the electrically conductivelayer; and a controller, configured to: direct the electric power to besupplied from the electric-power source to the electrically conductivelayer; and direct the electromagnetic-radiation emitter to generate theelectromagnetic radiation when the electric power is supplied to theelectrically conductive layer, wherein when the electric power issupplied to the electrically conductive layer, and: when theelectromagnetic radiation is generated, so that the photoconductor isilluminated at a first radiation level, a first level of electriccurrent is enabled through the photoconductor and the at least onedeposition electrode; and when the electromagnetic radiation isgenerated, so that the photoconductor is illuminated at a secondradiation level, a second level of electric current is enabled throughthe photoconductor and the at least one deposition electrode, the secondlevel of the electric current is different than the first level of theelectric current.
 2. The electrochemical-deposition apparatus accordingto claim 1, wherein: the electrically conductive layer is interposedbetween the electromagnetic-radiation emitter and the photoconductor;and when generated, at least a portion of the electromagnetic radiationpasses through the electrically conductive layer and illuminates thephotoconductor.
 3. The electrochemical-deposition apparatus according toclaim 2, wherein the electrically conductive layer comprises anelectrically conductive material that is at least partially transparentto the at least the portion of the electromagnetic radiation.
 4. Theelectrochemical-deposition apparatus according to claim 3, wherein: theelectromagnetic radiation is one of visible light or non-visible light;and the electrically conductive material is transparent to the one ofthe visible light or the non-visible light.
 5. Theelectrochemical-deposition apparatus according to claim 3, wherein theelectrically conductive material comprises an aperture, through whichthe at least the portion of the electromagnetic radiation is passablefrom the electromagnetic-radiation emitter to the photoconductor.
 6. Theelectrochemical-deposition apparatus according to claim 3, wherein: theelectrically conductive layer further comprises an electricallynon-conductive substrate; the electrically non-conductive substrate isat least partially transparent to the at least the portion of theelectromagnetic radiation; and the electrically non-conductive substrateis interposed between the electrically conductive material and theelectromagnetic-radiation emitter so that, when generated, the at leastthe portion of the electromagnetic radiation passes through theelectrically non-conductive substrate.
 7. The electrochemical-depositionapparatus according to claim 1, further comprising a photoconductorarray, comprising a plurality of photoconductors, wherein thephotoconductor is one of the plurality of photoconductors and each oneof the plurality of photoconductors is electrically coupled with acorresponding one or more of the deposition electrodes, wherein theelectromagnetic-radiation emitter is configured to generate theelectromagnetic radiation so that, when generated, at least the portionof the electromagnetic radiation illuminates any one or more of theplurality of photoconductors.
 8. The electrochemical-depositionapparatus according to claim 7, wherein when the electromagneticradiation is generated: the electromagnetic radiation illuminates atleast two of the plurality of photoconductors; a first one of the atleast two of the plurality of photoconductors receives a first quantityof the electromagnetic radiation; a second one of the at least two ofthe plurality of photoconductors receives a second quantity of theelectromagnetic radiation; and the first quantity is different than thesecond quantity.
 9. The electrochemical-deposition apparatus accordingto claim 7, wherein the electromagnetic-radiation emitter is movable,relative to the photoconductor array.
 10. The electrochemical-depositionapparatus according to claim 7, wherein the electromagnetic-radiationemitter comprises a plurality of electromagnetic-radiation-generatingelements, spaced apart from each other and each configured to one of:selectively generate the electromagnetic radiation; or selectivelypermit the electromagnetic radiation to pass therethrough.
 11. Theelectrochemical-deposition apparatus according to claim 1, wherein: theelectromagnetic-radiation emitter comprises a laser; and theelectromagnetic radiation is a laser beam.
 12. Theelectrochemical-deposition apparatus according to claim 1, wherein theelectromagnetic-radiation emitter comprises a light-emitting diode. 13.The electrochemical-deposition apparatus according to claim 1, wherein:the electromagnetic-radiation emitter comprises a liquid crystal displayand a backlight source; and the liquid crystal display is interposedbetween the backlight source and the photoconductor.
 14. Anelectrochemical-deposition system, comprising: an electrolytic solution;a target electrode, positionable so that a surface of the targetelectrode is in direct physical contact with the electrolytic solution;and an electrochemical-deposition apparatus, comprising: a depositionelectrode, positionable so that a surface of the deposition electrode isin direct physical contact with the electrolytic solution; aphotoconductor, electrically coupled with the deposition electrode; anelectrically conductive layer, electrically coupled with thephotoconductor and positioned so that the photoconductor is electricallyinterposed between the deposition electrode and the electricallyconductive layer; and an electromagnetic-radiation emitter, configuredto generate electromagnetic radiation and positioned so that whengenerated, at least a portion of the electromagnetic radiationilluminates the photoconductor, which, when the surface of the targetelectrode and the surface of the deposition electrode are in directphysical contact with the electrolytic solution, establishes an electriccurrent through the photoconductor, the deposition electrode, theelectrolytic solution, and the target electrode to electroplate aquantity of electrically charged material in the electrolytic solutiononto the surface of the target electrode.
 15. Theelectrochemical-deposition system according to claim 14, wherein: theelectrochemical-deposition apparatus further comprises: a plurality ofdeposition electrodes; and a plurality of photoconductors, eachelectrically coupled with a corresponding one of the plurality ofdeposition electrodes; and the electromagnetic-radiation emitter isconfigured to selectively generate separate quantities of theelectromagnetic radiation so that, when generated at least a portion ofeach one of the separate quantities of the electromagnetic radiationilluminates a corresponding one or corresponding ones of the pluralityof photoconductors.
 16. The electrochemical-deposition system accordingto claim 14, wherein when the surface of the target electrode and thesurface of the deposition electrode are in direct physical contact withthe electrolytic solution: the electrically conductive layer isinterposed between the electromagnetic-radiation emitter and thephotoconductor; and when generated, at least a portion of theelectromagnetic radiation passes through the electrically conductivelayer and illuminates the photoconductor.
 17. A method of electroplatinga target electrode, the method comprising steps of: establishing directphysical contact between a surface of the target electrode and anelectrolytic solution, comprising electrically charged material;establishing direct physical contact between a surface of a depositionelectrode and the electrolytic solution; supplying electric power to anelectrically conductive layer; and delivering at least a portion ofelectromagnetic radiation to a photoconductor that is electricallycoupled with the deposition electrode and with the electricallyconductive layer, so that: an electric current is established throughthe electrically conductive layer, the photoconductor, the depositionelectrode, the electrolytic solution, and the target electrode; and aquantity of the electrically charged material in the electrolyticsolution is electroplated onto at least a portion of the surface of thetarget electrode in direct physical contact with the electrolyticsolution.
 18. The method according to claim 17, wherein: the step ofestablishing direct physical contact between the surface of thedeposition electrode and the electrolytic solution comprisesestablishing direct physical contact between surfaces of a plurality ofdeposition electrodes and the electrolytic solution; and the step ofdelivering the at least the portion of the electromagnetic radiation tothe photoconductor comprises delivering the at least the portion of theelectromagnetic radiation to at least two of a plurality ofphotoconductors or delivering a plurality of amounts of theelectromagnetic radiation to a corresponding one or multiple ones of theplurality of photoconductors.
 19. The method according to claim 17,wherein the step of delivering the at least the portion of theelectromagnetic radiation to the photoconductor comprises adjusting atleast one of an intensity or a quantity of the at least the portion ofthe electromagnetic radiation delivered to the photoconductor so that anamplitude of the electric current, established through the electricallyconductive layer, the photoconductor, the deposition electrode, theelectrolytic solution, and the target electrode, is adjusted, and thequantity of the electrically charged material electroplated onto the atleast the portion of the surface of the target electrode is adjusted.20. The method according to claim 17, wherein the step of delivering theat least the portion of the electromagnetic radiation further comprisespassing the at least the portion of the electromagnetic radiationthrough the electrically conductive layer before delivering the at leastthe portion of the electromagnetic radiation to the photoconductor.